4.12.2 5RKVWRI¿QKDOW

'HU0DWHULDOEHGDUISUR,Q*D1/('&KLSZXUGHPLW +LOIH GHU LQ7DE JHQDQQWHQ =DKOHQ EHUHFK -QHW 'HU 5RKVWRIIEHGDUI IU GLH 3URGXNWLRQ HUJLEW VLFKDXVHLQHU0DWHULDOÀXVVDQDO\VHGLHLQQHUKDOE GHVHXURSlLVFKHQ3URMHNWHV&\F/('GXUFKJHIKUW ZXUGH D^EUBZER HW DO )U GLH /('&KLS 3URGXNWLRQZHUGHQGQQH6FKLFKWHQGHU0DWHULD-OLHQDXIHLQHP6DSKLUH:DIHUPLW+LOIHGHUPHWDOORU -JDQLVFKHQ FKHPLVFKHQ *DVSKDVHQDEVFKHLGXQJ 02&9'HSLWD[LVFKDEJHVFKLHGHQ'LH6FKQHOOLJ -NHLWXQG(I¿]LHQ]GHU$EVFKHLGXQJNDQQJHVWHXHUW ZHUGHQVRGDVVEHLGHQWHXUHQ+DOEOHLWHUPDWHUL - DOLHQ,QGLXPXQG*DOOLXPELV]XGHVHLQJH-VHW]WHQ0DWHULDOVDXIGHP6DSKLUVXEVWUDWODQGHW :HLWHUH3UR]HVVHGLHGLH0DWHULDODXVEHXWHZlK-UHQGGHU3URGXNWLRQEHVWLPPHQVLQG

– 2EHUÀlFKHQVWUXNWXULHUXQJEHLGHUHWZDHLQ )QIWHOGHV]XYRUDEJHVFKLHGHQHQ0DWHULDOV DEJHlW]WZLUG

– 'LH3UR]HVVDXVEHXWHZHOFKHEHVWLPPWZLH YLHOH:DIHUIHUWLJSUR]HVVLHUWZHUGHQYDULLHUW DEKlQJLJYRP+HUVWHOOHU]ZLVFKHQXQG JU|‰HU

)UGLH0DWHULDOÀXVVDQDO\VHZXUGHDQJHQRPPHQ GDVV GHV HLQJHVHW]WHQ 0DWHULDOV DXI GHP 6XEVWUDWDEJHVFKLHGHQXQGGHU:DIHUIHUWLJ SUR]HVVLHUWZHUGHQEHYRUVLHIUGDV9HUHLQ]HOQ XQG GLH /('3DFNDJH 3URGXNWLRQ LQ GLH Ä%DFN (QG³3UR]HVVHJHKHQ'DVKHL‰WGLH3UR]HVVYHU-OXVWHGXUFKGDV9HUHLQ]HOQGHU:DIHULQ&KLSVXQG GHU 9HUZXUI YRQ /('3DFNDJHV RGHU /('&KLSV LP%DFN(QGZHUGHQKLHUQLFKWEHWUDFKWHW

4.12.3 Foresight industrielle Nutzung

/('VZHUGHQLQGHU%HOHXFKWXQJIU$XWRPRELO-VFKZHLQZHUIHU DOV +LQWHUJUXQGEHOHXFKWXQJ IU /&'V IU 6LJQDOH XQG 6FKLOGHU XQG IU ZHLWHUH NOHLQH $QZHQGXQJHQ ZLH .DPHUDEOLW]H 6LJQDO GLRGHQXQG6SLHO]HXJYHUZHQGHW'LHZLFKWLJVWHQ 0lUNWHVLQG%HOHXFKWXQJXQG'LVSOD\KLQWHUJUXQG -EHOHXFKWXQJ<2/(E

8PGLHIUGLH3URGXNWLRQEHQ|WLJWHQ5RKVWRIIEH-GDUI]XEHUHFKQHQZLUGGLHGHU]HLWYHUZHQGHWHQ 02&9'5HDNWRUNDSD]LWlW YHUZHQGHW GLH LQ 7,(

WZRLQFKZDIHUHTXLYDOHQWVDQJHJHEHQZLUG(V ZHUGHQ GHU]HLW QXU HWZD GHU EHVWHKHQGHQ 5HDNWRUNDSD]LWlW EHQ|WLJW XP GLH 1DFKIUDJH ]X GHFNHQ<2/(E'LHEHQ|WLJWH5HDNWRUND-SD]LWlWZLUGYRQ<2/(ELQHLQHP%DVLVV]H - QDULRDEKlQJLJYRQGHU1DFKIUDJHELVIRUWJH-IKUW)UGLH3URJQRVHZXUGHQEHUGLH:HUWHGHU -DKUH ELV HLQH 3RWHQ]IXQNWLRQ JHOHJW XQGGLHVHELVIRUWJHIKUW7DE Tab. 4.30: Materialinhalt der aktiven pn-Schicht eines InGaN-Chips

Element Dicke Massenanteil Dichte Masse pro 1 mm² Chip Produktionsbedarf

[μm] [%vol] [g/cm³] [μg/mm²] [μg/mm²]

*D

In

1,QGLXPLVWQXULPVHKUGQQHQ+DOEOHLWHUEHUJDQJaQP]X¿QGHQ

Tab. 4.31: Projektionen der prozessierten :DIHUÀlFKHHLJHQH%HUHFKQXQJHQ basierend auf YOLE 2013b)

[Mio. mm²]

02&9'5HDNWRU 'XUFKVDW],Q*D1

,P-DKUZXUGHQHWZDW,QGLXPIUGLH+HU-VWHOOXQJYRQ,Q*D1/('VEHQ|WLJW'DVLVWZHQLJ LP 9HUJOHLFK ]X GHU *HVDPWSURGXNWLRQ LP -DKU YRQW:lFKVWGHU0DUNWZLHLQGHQ3UR -MHNWLRQHQDQJHQRPPHQVWHLJWGHU5RKVWRIIEHGDUI IU:/('VDXIGDVIDFKHW,QGLXP 'HU*DOOLXPEHGDUIIU:/('EHWUXJLP-DKU WFDGHUMlKUOLFKHQ*DOOLXPSURGXNWLRQ/DXW 3URMHNWLRQVWHLJWGHU%HGDUIDXIW*DOOLXPDOVR FDGHUZHOWZHLWHQ*DOOLXPSURGXNWLRQLP-DKU 'LHGHXWOLFKQLHGULJHUH1DFKIUDJHQDFK*DO -OLXPYRQZHL‰HQ/('VLP9HUJOHLFK]XANGERER et DONRPPWKDXSWVlFKOLFKGDGXUFK]XVWDQGH GDVV GHU DNWXHOOH SURGXNWLRQVVSH]L¿VFKH %HGDUI deutlich niedriger ist als in A^NGERERHWDO DQJHQRPPHQ'HUSURGXNWLRQVVSH]L¿VFKH%HGDUI in A^NGERERHWDOEDVLHUWDXIGHP9HUEUDXFK HLQHU%HVFKLFKWXQJVDQODJHLQGHU)RUVFKXQJGHU DNWXHOOHSURGXNWLRQVVSH]L¿VFKH%HGDUIEDVLHUWDXI

$QQDKPHQ ]X UHODWLY KRKHQ$XVEHXWHQ LQ JUR‰-WHFKQLVFKHQ %HVFKLFKWXQJVDQODJHQ EHL DNWXHOOHQ 6FKLFKWGLFNHQ

'LHVSH]L¿VFKHQ5RKVWRIIPHQJHQSUR'LRGHN|Q-QHQ MH QDFK +HUVWHOOHU XQG *HRPHWULH GHU /('V YDULLHUHQ+RKH8QVLFKHUKHLWHQHUJHEHQVLFKDXFK GXUFK8QWHUVFKLHGHLQGHQ0DWHULDOXQG3UR]HVV DXVEHXWHQMHQDFK+HUVWHOOHU=XP%HLVSLHONDQQ GLH5RKVWRIIQXW]XQJEHLGHU%HVFKLFKWXQJ(SLWD -[LHDXFKXQWHUOLHJHQ=XGHPNRPPHQQRFK GLH 5RKVWRIIYHUOXVWH GXUFK GLH 9HUHLQ]HOXQJ XQG GHQ9HUZXUIYRQ/('&KLSVRGHU/('3DFNDJHV KLQ]X$XIGHUDQGHUHQ6HLWHN|QQWHVHLQGDVVDXI - JUXQGGHUOlQJHUHQ/HEHQVGDXHUQGHU/('/HXFK-WHQ VRZLH GHU 9HUGUlQJXQJ GHU /&' GXUFK GLH

=XGHPZHUGHQURWHXQGJHOEH/('VGHUHQ+DOEOHL - WHUVFKLFKWDXI$O3,Q*D$VEDVLHUWGLHDOV(SLWD-[LVFKLFKWDXI*D$V:DIHUQVWDWWDXI6DSKLU:DIHUQ JH]FKWHWZLUGQLFKWEHDFKWHW1DFK(QWVWHKXQJ ZHUGHQ GLH *D$V:DIHU ELV DXI GLH ZHQLJH 0LN -URPHWHU GLFNH (SLWD[LHVFKLFKW UXQWHUJHVFKOLIIHQ

=XVlW]OLFK HQWVWHKHQ DXFK JUR‰H $EIDOOPHQJHQ EHLGHU:DIHUIHUWLJXQJVLHKHDXFK.DSLWHO

4.12.5 Recycling, Ressourcen-HI¿]LHQ]XQG6XEVWLWXWLRQ

(LQ 5HF\FOLQJ YRQ +DOEOHLWHUPDWHULDOLHQ DXV ZHL

- ‰HQ/('VZlUHDXIJUXQGGHUJHULQJHQ.RQ]HQWUD-WLRQHQ VFKZLHULJ XQG DXIZlQGLJ$EVFKlW]XQJHQ LPHXURSlLVFKHQ3URMHNW&\F/('KDEHQHUJHEHQ GDVV GLH ,Q XQG *D.RQ]HQWUDWLRQHQ LP /(' 3DFNDJHVHKUQLHGULJVLQG$EE6FKDXWPDQ VLFKGLH*HUlWHDQLQGHQHQ/('VDOV/HXFKWPLW -WHORGHU/&'5FNEHOHXFKWXQJHLQJHVHW]WZHUGHQ VLQNWGLH.RQ]HQWUDWLRQGHXWOLFK

(LQH$EVFKlW]XQJGHU5HVVRXUFHQÀVVHLQQHUKDOE (XURSDVKDWJH]HLJWGDVVGHU,QGLXPXQG*DOOL-XP,QKDOWLQ/('3URGXNWHQ/HXFKWHQ'LVSOD\V GLH LP -DKU DP (QGH LKUHU 1XW]XQJVGDXHU VLQG QXU ZHQLJH .LORJUDPP EHWUlJW D^EUBZER et DO 'LH *HKDOWH YRQ ,QGLXP=LQQ2[LG LQ /&'V ZHUGHQ LQ .DSLWHO EHKDQGHOW 'D HV VLFK IU GLHVH JHULQJHQ 0HQJHQ ZDKUVFKHLQOLFK QLFKW ORKQW HLQ JHWUHQQWHV 5HF\FOLQJV\VWHP DXI - ]XEDXHQEHVWHKWGHUGHU]HLWHIIHNWLYVWH5HVVRXU-FHQVFKXW]GDULQP|JOLFKVWGLH1XW]XQJVGDXHUGHU 3URGXNWHDQGLHODQJHWHFKQLVFKH/HEHQVGDXHUGHU /('VKXQGPHKUDQ]XSDVVHQ7\SLVFKH

Tab. 4.32: Globale Produktion (Quelle: BGR 2015b) und Rohstoffbedarf für InGaN-LEDs in t

Rohstoff Produktion 2013

5DI¿QDGHSURGXNWLRQ Bedarf 2013 Bedarfsvorschau 2035

Indium

*DOOLXP

1 Quelle: USGS 2015a, Primärproduktion

.RQVXPPXVWHU ]% (UVDW] HLQHV UHODWLY MXQJHQ )ODFKELOGVFKLUPVZHJHQWHFKQLVFKHU2EVROHV]HQ]

RGHU UHJHOPl‰LJH (UQHXHUXQJ GHV /LFKWV\VWHPV LPNRPPHU]LHOOHP%HUHLFKVHW]HQGLHVHP$QVDW] ]X 3UR]HVVDXVEHXWHQ XQG 3URGXNWLRQVUHF\FOLQJ VLQGKLHUYRUKDQGHQ'DGLHPHLVWHQ/('+HUVWHO-OHUDX‰HUKDOE(XURSDVVLW]HQLVWGHU(LQÀXVVDXI GLHVH 5HVVRXUFHQÀVVH LQQHUKDOE (XURSDV DOOHU-GLQJVJHULQJ

$OV$OWHUQDWLYH]X*D1LQ/('VZLUG=LQQR[LGHLQH ,,9, +DOEOHLWHUYHUELQGXQJ XQWHUVXFKW$OOHUGLQJV LVW GDV SGRWLHUWH =Q2 QRFK QLFKW VWDELO JHQXJ bKQOLFKHVJLOWIUDQGHUH,,9,+DOEOHLWHUYHUELQGXQ-JHQZLH0J6HRGHU=Q6H$XI.RPSRQHQWHQHEHQH N|QQHQ .RPSDNWOHXFKWVWRIÀDPSHQ RGHU QHQ YHUZHQGHW ZHUGHQ $OOHUGLQJV VLQG *OKELU-QHQDXV(I¿]LHQ]JUQGHQLQ(XURSDYHUERWHQXQG .RPSDNWOHXFKWVWRIÀDPSHQ VLQG TXHFNVLOEHUKDOWLJ XQGEHQ|WLJHQGHXWOLFKPHKU6HOWHQH(UGHQIUGHQ /HXFKWVWRII'LHVHN|QQHQEHL(QHUJLHVSDUODPSHQ DXV GHQ /HXFKWVWRIIHQ ]XUFNJHZRQQHQ ZHUGHQ (W^ALTERZRIUEHL/('VQRFKNHLQ3UR]HVV H[LVWLHUW 2UJDQLVFKH /HXFKWGLRGHQ 2/('V JHO-WHQ DOV DOWHUQDWLYH Ä=XNXQIWVWHFKQRORJLH³ VLHKH .DSLWHO,QGLXP=LQQ2[LG,72LQGHU'LVSOD\-WHFKQLN]XU/('7HFKQRORJLHDOOHUGLQJVVLQGVLH ZHJHQ.RVWHQXQG=XYHUOlVVLJNHLW]X/('VGHU-]HLWQRFKQLFKWNRQNXUUHQ]IlKLJT^ERCERO E^SPINOZA HWDO

4.13 Glasfaserkabel

4.13.1 Technologiebeschreibung

:LHLQ$EEYHUDQVFKDXOLFKWVLQG*ODVIDVHU-NDEHO/LFKWZHOOHQOHLWHUZHOFKH/LFKWEHUOlQJHUH 6WUHFNHQEHUWUDJHQN|QQHQ

/LFKW LVW HOHNWURPDJQHWLVFKH 6WUDKOXQJ EHVWHKW DOVRDXVHOHNWULVFKHQXQGPDJQHWLVFKHQ)HOGHUQ 1DFK UlXPOLFKHP 9HUODXI GHU HOHNWULVFKHQ XQG PDJQHWLVFKHQ )HOGVWlUNH ODVVHQ VLFK 6FKZLQ -JXQJVPRGHQ XQWHUVFKHLGHQ :HOFKH GLHVHU 6FKZLQJXQJVPRGHQHLQ:HOOHQOHLWHUWUDQVSRUWLHUW KlQJW YRQ VHLQHU *HRPHWULH XQG %HVFKDIIHQKHLW DE%HL*ODVIDVHUNDEHOQXQWHUVFKHLGHWPDQ0RQR XQG0XOWLPRGHNDEHO0RQRPRGHNDEHOEHUWUDJHQ QXUHLQHHLQ]LJH/LFKWPRGHXQGN|QQHQRKQH6LJ -QDOYHUVWlUNXQJ6WUHFNHQELV]XPHKUHUHQNP

EHUEUFNHQ 'DJHJHQ EHUWUDJHQ 0XOWLPRGH -NDEHO PHKUHUH /LFKWPRGHQ ZDV EHL OlQJHUHQ 6WUHFNHQ ]XU 6LJQDOYHUIlOVFKXQJ DXIJUXQG YRQ hEHUODJHUXQJHQIKUW6LHVLQGDOOHUGLQJVNRVWHQ-JQVWLJHUDOV0RQRPRGHNDEHOXQGZHUGHQGDKHU EHYRU]XJW IU NU]HUH hEHUWUDJXQJVVWUHFNHQ HLQ-JHVHW]W 'LH 6LJQDOYHUIlOVFKXQJ GHU 0XOWLPRGHQ-IDVHUQ OlVVW VLFK ]XGHP GXUFK GHQ (LQVDW] YRQ

*UDGLHQWHQIDVHUQPLOGHUQ$QGHUVDOVGLHLQ$EE GDUJHVWHOOWHQ 6WXIHQIDVHUQ PLW DEUXSWHP VWXIHQI|UPLJHP hEHUJDQJ GHU %UHFKXQJVLQGLFHV lQGHUWVLFKGHU%UHFKXQJVLQGH[EHL*UDGLHQWHQID -VHUQDOOPlKOLFK

/LFKWVWUDKOXQJ LP :HOOHQOlQJHQEHUHLFK ]ZLVFKHQ

±QP,5±89NDQQEHUWUDJHQZHUGHQ

$OV/LFKWTXHOOHQGLHQHQ/('VRGHU/DVHU

Gerät/Baugruppe/Bauteil ™6(

[Gew.-%]

Ga [Gew.-%]

In [Gew.-%]

7DEOHW79 ”[^± sehr niedrig sehr niedrig 5HWUR¿W/('/DPSH

Abb. 4.33: Konzentration von In, Ga und Seltenen Erden (REMs) in Produkten und Komponenten (Quelle: DEUBZER et al. 2014)

bX‰HUOLFKXPJLEWGLH/LFKWZHOOHQOHLWHUHLQH6FKXW] -EHVFKLFKWXQJ ]% DXV 3RO\DPLG 6LOLNRQ RGHU

$FU\OODFNXQGHLQH+OOH$EE(LQ*ODVID - VHUNDEHONDQQGDEHLPHKUHUHELV]X*ODV-IDVHUQ HQWKDOWHQ 'DKHU LVW EHL 0HQJHQDQJDEHQ ]ZLVFKHQ .DEHO XQG )DVHUNLORPHWHUQ ]X XQWHU-VFKHLGHQ

Herstellung

%HL GHU +HUVWHOOXQJ YRQ *ODVIDVHUQ IHUWLJW PDQ ]XQlFKVW HLQH 9RUIRUP engl 3UHIRUP DXV GHU DQVFKOLH‰HQG )DVHUQ JH]RJHQ ZHUGHQ 'LH 9RU-IRUPDXVKRFKUHLQHP6LOLFDJODV6L2ZLUGGXUFK FKHPLVFKH *DVSKDVHQDEVFKHLGXQJ engl &KH-PLFDO9DSRXU'HSRVLWLRQ&9'YRQ7HWUDFKORUVLODQ 6L&O XQG 6DXHUVWRII JHVFKDIIHQ 'RWLHUXQJHQ

MANN 2015

Anwendung

*ODVIDVHUNDEHO ZHUGHQ YRUUDQJLJ DOV hEHUWUD -JXQJVPHGLXP LQ GHU 1DFKULFKWHQWHFKQLN HLQJH-VHW]W9RUWHLOHJHJHQEHUKHUN|PPOLFKHQ.XSIHU -NDEHOQEHVWHKHQLQGHUK|KHUHQ5HLFKZHLWHELV]X PHKUHUHQNPRKQH=ZLVFKHQYHUVWlUNHUXQG GHU JU|‰HUHQ hEHUWUDJXQJVUDWH *LJD ELV 7HUD ELWVGHU*ODVIDVHUNDEHO

0RGHUQH .RPPXQLNDWLRQVQHW]H EHVWHKHQ GDKHU LQ .HUQEHUHLFKHQ VR JHQDQQWHQ %DFNERQHV LQ GHQHQKRKHhEHUWUDJXQJVUDWHQEHQ|WLJWZHUGHQ IDVW DXVVFKOLH‰OLFK DXV *ODVIDVHUNDEHOQ =X GLH-VHQ %DFNERQHV ]lKOHQ .HUQEHUHLFKVQHW]ZHUNH YRQ 7HOHNRPPXQLNDWLRQVXQWHUQHKPHQ

.DEHO-Kern n_K Mantel n_M

Schutzbeschichtung Hülle

n_K > n_M

Abb. 4.34: Aufbau und Funktion eines Glasfaserkabels. Der Brechungsindex des Kerns ist JU|‰HUDOVGHU%UHFKXQJVLQGH[GHV0DQWHOVQ.!Q0VRGDVVHVDQGHU*UHQ]ÀlFKH ]XU7RWDOUHÀH[LRQNRPPWVREDOG/LFKWVWUDKOHQÀDFKJHQXJHLQIDOOHQ'DKHUNDQQGDV Licht durch den Kern über weite Strecken geführt werden

(Quelle: eigene Darstellung)

IHUQVHKQHW]EHWUHLEHUQ XQG (QHUJLHYHUVRUJHUQ /HW]WHUHYHUOHJHQ*ODVIDVHUNDEHOJHPHLQVDPPLW DQGHUHQ/HLWXQJHQXQGEHWUHLEHQGLHVH]XUhEHU -ZDFKXQJ LKUHU /HLWXQJHQ XQG ]XU 9HUPLHWXQJ DQ 7HOHNRPPXQLNDWLRQVXQWHUQHKPHQXQG.DEHOIHUQ -VHKQHW]EHWUHLEHU

'HU $QVFKOXVV HLQ]HOQHU (QGDEQHKPHU DQ GLH 1HW]ZHUNHHUIROJWKLQJHJHQPHLVWQRFKQLFKWEHU

*ODVIDVHUNDEHO 'HU $XVEDX VROFKHU *ODVIDVHU-NDEHODQVFKOVVHHUIROJWDEHUVHLWHLQLJHQ-DKUHQ YDLQ-DSDQ(XURSDXQGGHQ86$-HQDFK=LHO-punkt unterscheidet man dabei verschiedene so JHQDQQWH)77[$QVFKOVVH]%)771)LEUH7R 7KH 1HLJKERUKRRG1RGH )77+ )LEUH 7R 7KH +RPH)77%)LEUH7R7KH%XLOGLQJ),7+)LEUH ,Q7KH+RPH)77')LEUH7R7KH'HVN*U|‰ - hEHUWUDJXQJVUDWH GHU *ODVIDVHUQ )U )77[$Q-ZHQGXQJHQ ZXUGHQ GDKHU VSH]LHOOH *ODVIDVHUQ PLW JHULQJHUHP %LHJHYHUOXVW HQWZLFNHOW ZHOFKHU ]%GXUFKHLQHÀXRUGRWLHUWH6FKLFKWDPhEHUJDQJ .HUQ0DQWHO RGHU GXUFK 1DQRVWUXNWXUHQ HUUHLFKW ZLUGLI HWDO

1HEHQGHU1DFKULFKWHQWHFKQLNZHUGHQ*ODVIDVHUQ ]% LQ GHU 0HVV XQG 0HGL]LQWHFKQLN VRZLH IU +RFKOHLVWXQJVODVHUHLQJHVHW]W

Konkurrenztechnologien

Insbesondere in abgelegenen Regionen kann die 'DWHQEHUWUDJXQJDXFKYLD6DWHOOLWHUIROJHQ'LHV HLJQHWVLFKQXUZHQQGLH1DFKIUDJHXQGVRPLWGLH 'DWHQPHQJHUHODWLYJHULQJLVW)UGLH,QWHUQHWYHU-VRUJXQJLQDEJHOHJHQHQ5HJLRQHQZHUGHQGHU]HLW

%DOORQV ZHOFKH LQ GHU 6WUDWRVSKlUH ÀLHJHQ HQW-ZLFNHOW'DPLWZlUHQ.RVWHQHLQVSDUXQJHQJHJHQ

-EHUGHU6DWHOOLWHQWHFKQRORJLHP|JOLFK

Im Dokument Rohstoffe für (Seite 91-95)