MC-156• High-density mounting-type SMD of 1.5mm thickness.• Small with small packaging area and light weight.• Excellent environmental capability.• Most suitable for small communications devices.

Specifications (characteristics)

Recommended soldering pattern

External dimensions

Do not connect #2 and #3 to external device.

Internal connection

(Unit: mm)

#4 #4 #3

#1 #2

#3

#1

0.4

5.08

#2

2.51.3 1.5 max.3.3max.

7.1 max.

E A 8 9

1.2

1.51.01.5

1.2 3.88

(0.75) (0.75)

1.6

Crystal unit

MC-156

• High-density mounting-type SMD of 1.5mm thickness.

• Small with small packaging area and light weight.

• Excellent environmental capability.

• Most suitable for small communications devices.

Item

Nominal frequency

Storage temperature Operating temperature Maximum drive level

Soldering condition

Frequency tolerance(standard) Peak temperature(frequency) Temperature coefficient(frequency) Load capacitance

Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging

Shock resistance

Symbol

f TSTG

TOPR

GL TSOL

∆f/f θT

a CL

R1

C1

C0

IR fa

S.R.

Specifications

32.768kHz -55˚C to +125˚C

-40˚C to +85˚C 1.0µW max.

Twice at under 260˚C within 10 sec.

or under 230˚C within 3 min.

±20ppm, ±50ppm 25˚C ±5˚C -0.04ppm/ ˚C²max.

7pF 65 kΩ max.

1.9fF typ.

0.8pF typ.

500 MΩmin.

±3ppm/Y max.

±5ppm max.

Remarks please contact us for inquiries

about usable frequencies

Ta=25˚C, DL=0.1µW

Please consult us for other specification

Ta=25˚C ±3˚C, first year

Three drops on a hard board from 75 cm or excitation test with 3000G x 0.3ms x 1/2 sine wave x 3 directions

Actual size

THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT

There are some cases that a parts of the cylindrical capsule of quartz unit expose on the surface of the molding material.

16

range

Operating drive level 0.5µW max.