MC - 146

Ver. 98-2. 1998. 10. 26

THIN SMD LOW/MEDIUM-FREQUENCY CRYSTAL UNIT

MC - 146

• High-density mounting-type SMD of 1.3 mm thickness

• Small with small packaging area and light weight

• Excellent shock resistance and environmental capability

• Most suitable for small communications devices

n Specifications(characteristics)

Item Sym

bol

Specifications Remarks

Nominal frequency fo 32.768KHz

Storage temperature TSTG -55°C • +125°C Operating temperature TOPR -40°C • +85°C

Maximum drive level GL 0.5µW MAX.

Recommended drive level

DL 0.1µW

Frequency tolerance ∆f / f ± 20ppm • •50ppm Ta = 25°C , DL=0.1µW Peak temperature θ T 25°C ± 5°C

Temperature coefficient a -0.04 ppm /°C² MAX.

Load capacitance CL 6pF • ∞ (Standard 7pF) Please specify

Series resistance R1 65 KΩ MAX.

Insulation resistance IR 500MΩ MIN.

Aging fa ± 3ppm / Year MAX. Ta = 25°C± 3°C , first year

Shock resistance S.R. ± 5ppm MAX.

Three drops on a hard board from 75 cm or excitation test with

3000G x 0.3ms x 1/2 sine wave

Soldering condition ± 5ppm MAX. Refer to below chart.

n Reflow Soldering Condition

10 sec.MAX

240 deg. Celsius 235 MAX.

Degree Celsius

Seconds 200

150

90 sec. 40 sec. MAX.

Ver. 98-2 1998.11.24

1.1 5.1 1.1

0.5 0.35 0.5

MC-146

Preliminary

Unit 1=1mm

•¡ Internal connection •¡ Example of soldering pattern Lead terminals : Solder plating

#1 #2

#4 #3

There are some cases that a part of the cylindrical capsule of quartz unit expose on the surface of the molding material.

*Soldering effective area 0.25

•¡ External dimensions

0.55

6.9

#1 #2

#4 #3

1.4

0.15 1.3

#1

0.3 - 0.55

0.1 6.7 0.1

0.3

0.3

#4 #3

#2 0.3 - 0.6

0.2 0.2

0.2 0.2