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The method described above retuned very well defined and precise golden contact openings.

The rest of the process in general repeats the flow for a passive actuator described in Subsection 3.4.2.

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done. SiO2 of 500 nm thickness was grown on both sides of the wafers (Fig. 3.19), after which cleaning in the peroxymonosulfuric acid was repeated.

Figure 3.19: Microvalve flow: thermal oxidation

After that, a 50 nm thick layer of Cr was sputtered on the back side of wafers. After the first lithography step with 10 µm thick positive photoresist AZ^®4562, the etching of Cr in “Chrom Etch Plus” was done in order to achieve the back side alignment markings (Fig. 3.20).

Figure 3.20: Microvalve flow: back side alignment markings

Then, the adhesion and bottom electrodes layer of 15 nm of Cr, 80 nm of Au and other 15 nm of Cr was sputtered on the top side of the wafers (Fig. 3.21).

Figure 3.21: Microvalve flow: adhesion and bottom electrodes layer

After the second photolithography step²³, this metal sandwich was then dry etched in Ar-plasma as described in Subsection 1.4.3.1 (Fig. 3.22). Thermal paste was used to avoid overheating of the substrate and burning of the photoresist. The etching was done with the following parameters:

Power: 50 Watt Ar-flow: 20 sccm.

Pressure: 8 mTorr Time: 8×15 min.

Postprocessing: short dip into “Chrome Etch Plus”

23 Backside alignment

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In order to avoid the etching of the back side alignment markings during the dip into “Chrome Etch Plus”, they were manually covered with photoresist using a brush before the dip.

Figure 3.22: Microvalve flow: structured bottom electrodes

Then, a complex photolithography step was done. First, a thin 1,8 µm protective layer of a positive photoresist AZ^®1518 was spinned on to the electrodes. The wafers were then heated on the hot plate for 2 minutes at 120°C. After that the back side was covered with a 10 µm thick positive photoresist AZ^®4562. In order to avoid the DRIE of the alignment marking fields²⁴ on the wafer, the markings on the mask were manually covered with pieces of dark plastic. After that, an additional photolithography of 3 mm edge exclusion with one more special mask was done²⁵. After these procedures the DRIE process was performed (Fig. 3.23).

Three first wafers were lost due to strong chirping at the edge. The reason of chirping was not clearly determined. It was assumed to be a problem of the Alcatel DRIE tool. DRIE of the gas inlet channels crowns the process of the microvalve part of the flow. The subsequent steps generally repeated the flow developed for the production of an active microactuator and described in the Subsection 3.4.3. However, there were some differences connected with now more fragile and more sensitive to the external coercions structure.

Figure 3.23: Microvalve flow: DRIE of gas inlet channels

As it can be seen on Figure 3.23, there is a very thin (500 nm) SiO2 membrane, which covers the top of the inlet channel. Thus, careful handling had to be performed during the subsequent operations. It was not possible to use normal vacuum chucks (e.g. during photoresist spray coating) any more, since it could damage or even destroy the membranes and ruin the entire process. Special vacuum chucks were used instead. These chucks stick fast only to the edge region of the wafer.

After optical inspection under the microscope, PECVD of low-stress Si3N4 isolation layer over the top side of the wafers was done (Fig. 3.24).

24 They were also transparent on the mask

25 Requirement of the DRIE-Process, standard mask was used during lithography.

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Figure 3.24: Microvalve flow: PECVD of Si3N4 isolation

Figure 3.25 depicts a gas inlet opening without SiO2 membrane.

Figure 3.25: Gas inlet from the top side

The picture was taken after the whole microvalve production process was completed. The actuator was then torn off to make this photo possible.

Then, one more optical inspection step was performed in order to check the integrity of the membranes. After that, a sacrificial layer of 100 nm of Ti and 300 nm of Cu was sputtered (Fig.

3.26).

Figure 3.26: Microvalve flow: PVD of Ti/Cu sacrificial layer

In order to achieve the designed actuator geometries during future electroplating, Ti/Cu layer was structured in two lithography steps (Fig. 3.27). Also, Cr was wet etched from the areas where the actuator is attached to the bottom electrode. Contact openings were etched, too. These procedures are described in detail in the subsection 3.4.2.1.

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Figure 3.27: Microvalve flow: wet etching, microactuator geometry definition

Since no further backside alignment was needed, the backside alignment markings were not protected and hence, etched from the back side of the wafer as well as the backside layer of SiO2. Next, after photolithography with 30 µm thick positive photoresist AZ^®4562, two layers of Ni were electroplated as described in Sections 1.4..2.1 and 1.2 respectively (Fig. 3.28).

Figure 3.28: Microvalve flow: Ni electroplating

After the stripping of thick photoresist, the following step was to etch the SiO2/Si3N4

membrane from the back side (Fig. 3.29). In order not to attack Si3N4 on the front side, it was laminated with so called dry photoresist. After that, the wafers were plunged into Oxide Etch 7:1 solution for 15 minutes. After that, they were cleaned in DI water and dried in a spin rinse dryer.

Then, dry photoresist was exposed with UV-light in Süss MA6 mask aligner. After that the resist was stripped off in a Petri dish filled with photoresist developer.

Figure 3.29: Microvalve flow: back side etching of the SiO2/Si3N4 membrane

Now, the actuators had to be released and electrically disconnected from the bottom electrodes by etching of Ti/Cu sacrificial layer. First, Cu layer was completely etched with Alketch I+II solution in a Petri dish for 24 hours. Then, Ti was etched in SC1 for 30 – 60 min as described in Subsection 1.4.2.1. After that, the actuators were released (Fig. 3.30). The wafers were then washed in DI-water in a quick dump rinser and dried in a spin rinse dryer.

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Figure 3.30: Microvalve flow: actuator release

In order to make sure that the electrodes were electrically disconnected and there was no short circuit, some actuators were torn off. Figure 3.31 illustrates a complete etching of Ti/Cu sacrificial layer.

Figure 3.31: Electrically disconnected electrodes after Ti/Cu etching

For the upcoming characterization, single chips were needed. Hence, wafers had to be diced into single microvalve chips. Dicing procedure could be destructive for the actuators because of strong water flow introduced. This flow could detach the actuators from the surface. Therefore, second lamination with dry photoresist was done. Then, dry photoresist was exposed with UV-light in Süss MA6 mask aligner. Only after that the wafers were diced. And the resist was stripped off from single chips in a Petri dish. An REM photo (Fig. 3.32) represents a microvalve chip with microactuator and electrical contacts on top of it. Gas inlet channel is covered by microactuator beam and thus cannot be seen on this photo.

Figure 3.32: Fabricated microactuator on a chip (REM representation)

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The system is a normally-open 2/2 microvalve. In accordance with specifications, it is possible to build a 3/2 microvalve by using two chips on the same platform inside one package.