SED1750
Contents
OVERVIEW ... 4-1 TERMINAL FUNCTIONS ... 4-7 ABSOLUTE MAXIMUM RATINGS ... 4-11
OVERVIEW
The SED1750 is an MLS (Multi Line Selection) driving, 160 output, triple-value low resistance common (low) driver which can realize high picture quality and high speed responses.
Receiving signals from an LCD controller such as the SED1335 or SED1351, it works to make 4-line MLS drives in combination with the SED1580 or in combination with the SED1590 receiving signals direct from the MPU. Employing the SCI7500 as the power IC, the power to use for the MLS drive liquid crystal display system can be prepared easily.
Adopting a slim chip shape which is more advantageous to realize narrower borders with the LCD panels, the SED1750 is capable of making low voltage logic power operations and is applicable to a wide range of applications.
Owing to its pad layout designed to facilitate its installation to the substrate and thanks to its two-way choices of the driver output sequence, the highest working efficiency can be acquired with a 1/160 or 1/
320 duty panel.
Features
• LCD driver outputs ... 160
• Low output ON resistance
• High duty drive supported ... 1/320 (Reference value)
• Broad range of LC drive voltages ... + 14 to + 42 V (VCC = 2.7 to 5.5 V)
• Output shift direction pin select is possible
• Can be switched between 140 and 160 outputs
• Non-biased display OFF function
• Logic system power source ... 2.7 V to 5.5 V
• LC power source offset bias can be adjusted relative to the VDDH and GND levels
• Slim chip shape
• D0B... Au Bump die
• T0A... TCP
Pad Layout
Y Die.No.
X 179
1 180
203
68
43 67
44
Chip size 15.62 mm × 2.47 mm Pad pitch 80 µm (Min.) Chip thickness 525 µm ± 25 µm
1) Au Bump Specifications (SED1750DOB) Reference Values Only Au vertical bump
Parallel to Scribe × Perpendicular to Scribe ± Tolerance
Bump Size A 60 µm × 75 µm ± 4 mm (Pad No. 1 to 43, 68 to 179) Bump Size B 80 µm × 50 µm ± 4 mm (Pad No. 44 to 67, 180 to 203)
Bump height 17 to 28 µm (The details specified in the acceptance specifications.)
Units: µm
Pad Coordinates
51 COM8 7655 -375
52 COM9 -295
53 COM10 -215
54 COM11 -135
55 COM12 -55
56 COM13 25
57 COM14 105
58 COM15 185
59 COM16 265
60 COM17 345
61 COM18 425
62 COM19 505
63 COM20 585
64 COM21 665
65 COM22 745
66 COM23 825
67 COM24 905
68 COM25 7419.3 1083 69 COM26 7285.6 70 COM27 7152 71 COM28 7018.3 72 COM29 6884.7 73 COM30 6751 74 COM31 6617.3 75 COM32 6483.7 76 COM33 6350 77 COM34 6216.3 78 COM35 6082.7 79 COM36 5949 80 COM37 5815.3 81 COM38 5681.7 82 COM39 5548 83 COM40 5414.3 84 COM41 5280.7 85 COM42 5147 86 COM43 5013.3 87 COM44 4879.7 88 COM45 4746 89 COM46 4612.3 90 COM47 4478.7 91 COM48 4345 92 COM49 4211.4 93 COM50 4077.7 94 COM51 3944 95 COM52 3810.4 96 COM53 3676.7 97 COM54 3543 98 COM55 3409.4 99 COM56 3275.7 100 COM57 3142
Pin Name X Y
101 COM58 3008.4 1083 102 COM59 2874.7 103 COM60 2741 104 COM61 2607.4 105 COM62 2473.7 106 COM63 2340 107 COM64 2206.4 108 COM65 2072.7 109 COM66 1939 110 COM67 1805.4 111 COM68 1671.7 112 COM69 1538.1 113 COM70 1404.4 114 COM71 1270.7 115 COM72 1137.1 116 COM73 1003.4 117 COM74 869.7 118 COM75 736.1 119 COM76 602.4 120 COM77 468.7 121 COM78 335.1 122 COM79 201.4 123 COM80 67.7 124 COM81 -67.7 125 COM82 -201.4 126 COM83 -335.1 127 COM84 -468.7 128 COM85 -602.4 129 COM86 -736.1 130 COM87 -869.7 131 COM88 -1003.4 132 COM89 -1137.1 133 COM90 -1270.7 134 COM91 -1404.4 135 COM92 -1538.1 136 COM93 -1671.7 137 COM94 -1805.4 138 COM95 -1939 139 COM96 -2072.7 140 COM97 -2206.4 141 COM98 -2340 142 COM99 -2473.7 143 COM100 -2607.4 144 COM101 -2741 145 COM102 -2874.7 146 COM103 -3008.4 147 COM104 -3142 148 COM105 -3275.7 149 COM106 -3409.4 150 COM107 -3543
Pin Name X Y
Pin Name X Y
1 VDDH -7522 -1045
2 +V1 -7427
3 VC -7332
4 -V1 -7237
5 VSS -7142
6 SHL -6804
7 SEL -6579
8 VCC -6241 9 LSEL -5902 10 DOFF -5538
11 FR -4791
12 DM -4323
13 DM -3943
14 DM -3563
15 DM -3183
16 DM -2803
17 CSEL -2336
18 LP -1998
19 DM -1162
20 CIO2 -755
21 DM -347
22 DM 0
23 DM 347
24 CIO1 755
25 DM 1162
26 YD 1998
27 DM 2336
28 DM 2803
29 DM 3183
30 DM 3563
31 DM 3943
32 DM 4323
33 DM 4791
34 DM 5538
35 F1 5902
36 DM 6241
37 F2 6579
38 TEST1 6804
39 VSS 7142
40 -V1 7237
41 VC 7332
42 +V1 7427
43 VDDH 7522 44 COM1 7655 -935
45 COM2 -855
46 COM3 -775
47 COM4 -695
48 COM5 -615
49 COM6 -535
50 COM7 -455
169 COM126 -6082.7 1083 170 COM127 -6216.3 171 COM128 -6350 172 COM129 -6483.7 173 COM130 -6617.3 174 COM131 -6751 175 COM132 -6884.7 176 COM133 -7018.3 177 COM134 -7152 178 COM135 -7285.6 179 COM136 -7419.3 180 COM137 -7655 905
181 COM138 825
182 COM139 745
183 COM140 665
184 COM141 585
185 COM142 505
186 COM143 425
Pin Name X Y
187 COM144 -7655 345
188 COM145 265
189 COM146 185
190 COM147 105
191 COM148 25
192 COM149 -55
193 COM150 -135
194 COM151 -215
195 COM152 -295
196 COM153 -375
197 COM154 -455
198 COM155 -535
199 COM156 -615
200 COM157 -695
201 COM158 -775
202 COM159 -855
203 COM160 -935
Pin Name X Y
Pin Name X Y
151 COM108 -3676.7 1083 152 COM109 -3810.4 153 COM110 -3944 154 COM111 -4077.7 155 COM112 -4211.4 156 COM113 -4345 157 COM114 -4478.7 158 COM115 -4612.3 159 COM116 -4746 160 COM117 -4879.7 161 COM118 -5013.3 162 COM119 -5147 163 COM120 -5280.7 164 COM121 -5414.3 165 COM122 -5548 166 COM123 -5681.7 167 COM124 -5815.3 168 COM125 -5949
TERMINAL FUNCTIONS
Input Terminator
TEST1
Terminal Name I/O Function Number of
Terminals COM1 to
O Common (row) output to drive LC.
COM160 Output transition occurs on falling edge of LP. 160 Carry signal I/O.
CIO1 I/O This is set to input or output depending on the level of CIO2 the SHL input. Output transition occurs on falling edge 2
of LP.
YD I Frame start/pulse input, with terminator. (*1) 1 F1, F2 I Drive pattern select signal input, with terminator. (*1) 2 LP I Shift clock input for display data.
(Triggers on falling edge.) With terminator. (*1) 1
Shift direction select and CIO terminal I/O control input.
SHL I 1
The numbers in parentheses are for 140 output mode.
Select input for the number of COM output terminals:
SEL I 160 outputs ←→ 140 outputs L: COM1 to COM160 1 H: COM9 to COM148
LSEL I 1/2 H operation select signal input.
L: Normal operation. H: 1/2 operation. 1
Chip select signal input for when a cascade connection
CSEL I is used.
L: Leading chip 1 H: Other chips
FR I LC drive output AC signal input. With terminator (*1) 1 LC display blanking control input. With a low level input, DOFF I all common outputs are temporarily set to the VC level.
The contents of the latches are maintained. With 1 terminator (*1)
TEST1 I Test1 signal input. Normally tied at L. 1
VCC, GNDL,
PowerPower source for logic:
GNDR GND: 0 V , VCC: +2.7 to 5.5 V 3 VCL, VCR,
LC Drive Power:
+V1L, +V1R,
Power GND: 0 V, 8
-V1L, -V1R,
VDDH: + 14.0 to 42.0 V, VDDH≥ +V1≥ VC≥ –V1≥ GND VDDHL, VDDHR
DM Dummy pad 19
Total 203 Note: *1
SHL Output Shift Direction
CIO1 CIO2
L 1(9) → 160(148) Input Output
H 160(148) → 1(9) Output Input
Block Diagram
VDDHL GNDL +V1L VCL –V1L DOFF
VDDHR GNDR +V1R VCR –V1R
CIO2 LCD Driver: 160-bits
Level Shifter: 3x160-bits
Decoder
Bi-directional Shift Register: 40-bits Data Register:
160-bits VCC
TEST1
LP YD CIO1
COM 1 COM 160
SHL SEL LSEL CSEL
FR F1 F2
Explanation of Each Block
Shift RegisterThis is a bi-directional shift register used for transmitting common data. The display data shifts on the falling edge of LP.
Level Shifter
The level shifter is a voltage level converter circuit which converts the signal voltage level from a logic system level to the LC driver system voltage level.
LCD Driver
The LCD driver outputs the LC drive voltage.
The relationship between the display blanking signal DOFF, the field recognition signals F1 & F2, the AC signal FR, and the common output voltage is as follows:
DOFF H L
FR L H —
F1,F2 1,1 0,1 1,0 0,0 1,1 0,1 1,0 0,0 —
Line 1 +V1 +V1 –V1 +V1 –V1 –V1 +V1 –V1 VC
Line 2 –V1 +V1 +V1 +V1 +V1 –V1 –V1 –V1 VC
Line 3 +V1 –V1 +V1 +V1 –V1 +V1 –V1 –V1 VC
Line 4 +V1 +V1 +V1 –V1 –V1 –V1 –V1 +V1 VC
Voltage level relationships: + V1 > VC > –V1 (VC is the center voltage level)
Timing Diagram (1) 1/320 duty, normal operation.
SHL = L, SEL = L, LSEL = L, CSEL = L (This diagram provided only as a reference.)
+V1 VC –V1
F2 F1 FR LP
Driver 1 COM1
+V1 VC –V1 COM2
+V1 VC –V1 COM3
+V1 VC –V1 COM4
+V1 VC –V1 COM5
+V1 VC –V1 COM6
+V1 VC –V1 COM7
+V1 VC –V1 COM8
+V1 VC –V1 Driver 2 COM160
Field 1 Field 2 Field 3
1 Frame (320 lines)
Field 4
1 2 3 80 8182 83 160 161 162 163 240 241 242 243 320 1 2 3
1
1 2 3 4 5 40 41 42 43 80 81 82 83 120 121 122 123 160 161 162 163
2 3 4 5
320 lines
160 161 162 163 320 1 2 3 4
YD LP FR
LP CIO 1 CIO 2
Timing Diagram (2) 1/320 duty, 1/2 H operation.
SHL = L, SEL = L, LSEL = H, CSEL = L (This diagram provided only as a reference.)
+V1 VC –V1
F2 F1 FR LP
Driver 1 COM1
+V1 VC –V1 COM2
+V1 VC –V1 COM3
+V1 VC –V1 COM4
+V1 VC –V1 COM5
+V1 VC –V1 COM6
+V1 VC –V1 COM7
+V1 VC –V1 COM8
+V1 VC –V1 Driver 2 COM160
Field 1 Field 2 Field 3
1 Frame (320 lines)
Field 4
2/320 2/1 2/80 2/81 2/160 2/161 2/240 2/241 2/320 2/1
1/1 1/2 1/81 1/82 1/161 1/162 1/241 1/242 1/1 1/2
1/1
1/1
2/1 1/2
2/2 1/3 1/40
2/40 1/41
2/41 1/80
2/80 1/81
2/81 1/120
2/120 1/121
2/121 1/160
2/160 1/161
2/161 2/1 1/2 2/2 1/3
320 lines
1/160 2/161 1/162 2/163 2/320 1/1 2/1 1/2 2/2 YD
LP FR
LP CIO CIO 1 2
ABSOLUTE MAXIMUM RATINGS
Item Signal Rated Value Units
Power voltage (1) VCC –0.3 to +7.0 V
Power voltage (2) VDDH –0.3 to + 45.0 V
Power voltage (3) ± V1, VC GND – 0.3 to VDDH + 0.3 V
Input voltage VI GND – 0.3 to VCC + 0.3 V
Output voltage VO GND – 0.3 to VCC + 0.3 V
CIO output current IO1 20 mA
Operating temperature Topr –30 to +85 °C
Storage temperature 1 Tstg1 –65 to +150 °C
Storage temperature 2 Tstg2 –55 to +100 °C
NOTE 1: The voltages are all relative to GND = 0 V.
NOTE 2: Storage temperature 1 is for the chip alone, and storage temperature 2 is for the TCP product.
NOTE 3: Ensure that the relationship between +V1, VC, and –V1 is always as follows:
VDDH ≥ +V1 ≥ VC ≥ –V1 ≥ GND.
NOTE 4: The LSI may be permanently damaged if the logic system power is floating or VCC is less than or equal to 2.6 V when power is applied to the LC drive system. Special caution must be paid to the power sequences during power up and power down.
VCC
GND (–V1) VDDH/2 (VC) VDDH (+V1)
Logic System LCD System
Electrical Characteristics
DC CharacteristicsUnless otherwise noted, GND = 0 V, VCC = + 5.0 V ± 10%, Ta = –30 to 85°C
Item Signal Parameter Applicable
Min Typ Max Unit
Terminals Power Supply
VCC VCC 2.7 5.0 5.5 V
Voltage (1) Range Operating
VDDH Function VDDH 8.0 42.0 V
Voltages Power Supply
+V1 Recommended Value +V1 VDDH V
Voltage (2) Power Supply
VC Recommended Value VC VDDH/2 V
Voltage (3) Power Supply
–V1 Recommended Value –V1 GND V
Voltage (4) High-level Input
VIH 0.8VCC V
Voltage
VCC = 2.7 to 5.5V Low-level Input
VIL 0.2VCC V
Voltage High-level Output
VOH IOH =
VCC–0.4 V
Voltage
VCC = 2.7 to 5.5V –0.3mA
CIO1,CIO2 Low-level Output
VOL IOL =
0.4 V
Voltage 0.3mA
Input Leakage Current ILI GND ≤ VIN ≤ VCC 2.0 µA
Input/Output Leakage
ILI/O GND ≤ VIN ≤ VCC CIO1,CIO2 5.0 µA
Current
Static Current IGND VDDH = 14.0~42.0V
GND 25 µA
VIH = VCC, VIL = GND
∆VON = 0.5 V VDDH = 0.55 0.7
Output Resistance RCOM Recommended +30.0V COM1 to kΩ
parameter VDDH = COM120
0.5 0.7 +40.0V
VCC = +5.0 V, VIH = VCC
VIL = GND, fLP = 22.4 kHz
12 25
Average Operating fFR = 70 Hz,
Consumption Current ICC Input data: 1/320 No load VCC µA
(1) VCC = 3.0 V
All other parameters 8 17
the same as VCC = 5.0 V.
VDDH = +V1 = +30.0 V, Average Operating VC = VDDH/2, –V1 = 0.0 V,
Consumption Current IDDH VCC = 5.0 V VDDH 7 13 µA
(2) All other parameters
the same as the ICC item.
Input Terminal
CI Freq. = 1 MHz 10 pF
Capacity
Chip alone Input/Output Terminal
CI/O Ta = 25°C CIO1,CIO2 18 pF
Capacity
CIO1,CIO2,FR, YD,LP,SHL,SEL,
LSEL,CSEL, DOFF,F1,F2, TEST1
LP,YD,SHL,SEL, LSEL,CSEL,F1, F2,DOFF,TEST1,
FR
LP,YD,SHL,SEL, LSEL,CSEL,F1,F2,
DOFF,TEST1,FR
Range of Operating Voltages: VCC – VDDH
It is necessary to set the voltage for VDDH within the VCC – VDDH operating voltage range shown in the diagram below.
Range of Operating Voltage 50
42 40
30
20
10 28
8
0
2.0 2.7 3.0 4.0
VCC (V) VDDH (V)
5.0 5.5 6.0
AC Characteristics
Input Timing CharacteristicsThe FR latched at the nth LP is reflected in the output at the n+1th LP.
tDS tDH
tSET tWCLH tWCLL
tCCL
tFFDS tFFDH tr tf
tFRDS tFRDH
FR
F1, F2
LP YD CIO1, 2 (IN)
(VCC = +5.0 V ± 10%, Ta = –30 to +85°C)
Item Signal Parameter Min Max Units
LP Frequency
t
CCL 500 nsLP “H” Pulse Width
t
WCLH 55 nsLP “L” Pulse Width
t
WCLL 330 nsFR Setup Time
t
FRDS 100 nsFR Hold Time
t
FRDH 40F1, F2 Setup Time
t
FFDS 100F1, F2 Hold Time
t
FFDH 40Input Signal Rise Time
t
r 50 nsInput Signal Fall Time
t
f 50 nsCIO Setup Time
t
DS 100 nsCIO Hold Time
t
DH 40 nsYD → LP Allowable Time
t
SET 80 ns(VCC = +2.7 V to 4.5 V, Ta = –30 to +85°C)
Item Signal Parameter Min Max Units
LP Frequency
t
CCL 800 nsLP “H” Pulse Width
t
WCLH 100 nsLP “L” Pulse Width
t
WCLL 660 nsFR Setup Time
t
FRDS 200 nsFR Hold Time
t
FRDH 40F1, F2 Setup Time
t
FFDS 200F1, F2 Hold Time
t
FFDH 40Input Signal Rise Time
t
r 100 nsInput Signal Fall Time
t
f 100 nsCIO Setup Time
t
DS 200 nsCIO Hold Time
t
DH 40 nsYD → LP Allowable Time
t
SET 150 nsOutput Timing Characteristics
tpdCDOF
tpdCCL
tpdDOC LP
DOFF
COM Output CIO1, 2 (OUT)
(VCC = 5.0 V ± 10%, VDDH = +14.0 to +42.0 V, Ta = –30 to +85°C)
Item Signal Parameter Min Max Units
Delay time from LP to CIO output
t
pdDOC CL = 15 pF 300 ns Delay time from LP to COM outputt
pdCCL VDDH= 350 ns Delay time from DOFF to COM outputt
pdCDOF 14.0 V to 40.0 V 700 ns(VCC = +2.7 V to 4.5 V, VDDH = +14.0 to +28.0 V, Ta = –30 to +85°C)
Item Signal Parameter Min Max Units
Delay time from LP to CIO output
t
pdDOC CL = 15 pF 600 ns Delay time from LP to COM outputt
pdCCL VDDH= 500 ns Delay time from DOFF to COM outputt
pdCDOF 14.0 V to 40.0 V 1400 nsThe Power Supply
Method of Forming Each Voltage Level
VCC GND
Logic System LCD Controller
Capacitor Coupling
Logic System LCD System SED1590 SED1580
Logic System LCD System SED1750 VDDx
VSSx
VDDy VSSy V3
VC VC
V1
–V1 V2
–V2 –V3
When the SED1590 (SED1580) and the SED1750 are used to form an extremely low power module system, the power relationships as shown in the figure above between the SED1590 (SED1580) and SED1750 logic systems, and the LCD system power supply, and the LCD controller power supply are optimal.
In this case, care is required when it comes to signal propagation in the logic system.
LCD Controller → SED1580, SED1590 Direct
LCD Controller → SED1750 Capacitor coupling is required SED1580, SED1590 → SED1750 Capacitor coupling is required SED1750 → SED1580, SED1590 Capacitor coupling is required
Cautions at Power Up and Power Down
Because the voltage level in the LCD system is high voltage, if the logic system power supply of this LSI is floating or if VCC is 2.6 V or less when the LCD system high voltage (30 V or above) is applied, or if the LCD drive signal is output before the voltage level that is applied to the LCD system has stabilized, then there is the risk that there will be an over current condition in this LSI, resulting in permanent damage to this LSI.
It is recommended that the display OFF function (DOFF) is used until the LCD system voltage stabilizes to insure that the LCD drive output power level is at the VC level.
Be sure to follow the sequences below when turning the power supplies ON and OFF:
When turning the power supply ON:
Logic system ON → LCD drive system ON, or simultaneously ON.
When turning the power supply OFF:
LCD drive system OFF → Logic system OFF, or simultaneously OFF.
As a countermeasure to guard against over current conditions, it is effective to insert a high-speed fuse or a guard resistance in series with the LC power supply. The guard resistance value must be optimized depending on the capacity of the LC cell.
CIO1 SHL SEL CSEL;
YD DOFF F1 F2 YSCL FR TEST1 CIO2
OSC3
OSC2
OSC1
COD0
COD1
COD2
COD3
COD4
LR1
LR0M/S
C86
SLEEP
XRESD0–7
WRRD
A0CS
CA
DOFF
F2
F1CL
FR160out
SED1750D0B
160out SED1590D0B VSSy
VDDx
VSSx CD0CD1CD2CD3CD4 VEE
VL
LP DOFF VL VEE SCI7500
POWER SUPPLY YDr VLCD
V3, V2, VC, –V2, –V3 VH, VC, VL, VDDY, VSSY
MPU I/F
160×160 DOT 1/160 DUTY
XDr VLCD XDr VLCD
Electric Volume Condenser
Coupling