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Eight leading design companies from Europe have so far responded to EPSON's call and joined the initiative "EPSON Technology Partner (ETP)" for EPSON elec- tronic components. This will enable the partners to step up their efforts to supply their customers with EPSON solutions tailored to their specific country and to improve their response to product-specific questions.

The main aim of these technology partnerships is to make full use of synergy effects which, for the partners, will be gen- erated from market expertise and a knowledge of market- specific requirements. For its part, EPSON will benefit from product technology expertise, which can be conveyed direct- ly on a customer-focussed basis.

The ETPs can provide customers with specific design sup- port, system support and support in developing integration solutions for EPSON products. This means that the cus- tomer's solutions can be implemented quickly thanks to the broad network of skilled EPSON partners.

EPSON thereby succeeds in optimising its customer techni- cal support beyond its existing structures. A further Europe- wide extension of the ETP partner network means that EPSON will shortly be able to offer the best possible cus- tomer support for all its customers in their own countries.

The ETPs are each specialised in the support of software, hardware and integration solutions for the individual EPSON product groups ASIC, ASMIC (Application Specific Micro- controllers), System Level Products (Card PC) and ASSP (Application Specific Standard Product).

The synergy effect will of course result in an extension and expansion of existing operations for both the ETPs and EPSON, since all the companies involved in the partner pro- gram will enjoy a strengthening and increase in the efficien- cy of their own sales and support operations from the part- nerships.

EPSON is looking for further partners: please contact info@epson-electronics.de for detailed information.

EPSON TECHNOLOGY PARTNER ETP

N EWS L ETTER 2000 3

ETP

EPSON establishes co-operation with external partners to optimise technical support

ELEKTRONIK GMBH

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Expanded frequency range for high frequency oscillators

“SYSTEM-ON-CHIP” EOC37109/37109W

CMOS

The first system chip E0C37109/W is now available in the even more compact CSP424 PIN package. In contrast to the original 35 x 35 mm T-BGA package with a PIN distance of 1.27 mm, the new package measures just 17 x 17 mm and has a PIN distance of 0.8 mm. The E0C37109/W's new package includes a Hitachi SH7709-com- patible CPU, a built-in LCD controller (SED1354), along with further interface functions such as PCMCIA (with companion chip), compact flash, keyboard, mouse and an ISA bus sub- set. The package, which is now more compact than ever, makes it possible to produce portable information devices with LCD or POS terminals which are even smaller and easi- er to carry. Thanks to the high integration density and the power-saving design, the E0C37109/W creates the ideal con- ditions for battery-operated information and multimedia systems.

HIGHER FREQUENCY RANGE SG-W SERIES QD

With respond to the demand for handling high frequencies from the network related market, EPSON developed the new SG-W series. This series is based on the well known SG series of oscillators and improvements in some specifications lead to the design of the new SG-W series. These new components expand the available output frequency range up to 135 MHz. This achievement has been realized through EPSON´s leading edge PLL technology, which is especially designed for providing very low long- term jitter levels.

The oscillators of the SG-W series are ideal for networking applications, personal computers and peripherals and all applications where high frequencies with low jitter are needed. The oscillators operate on a supply voltage of 3.3 V (+/- 0.3 V) or 5.0 V (+/- 0.5 V) with a frequence stability of +/- 50 or +/- 100 ppm. The oscillators are available as SG- 531W, SG-615W, SG-636W, SG-710W.

S p e c i f i c a t i o n s

Power supply 3.3 V +/- 0.3 V; 5 V for peripherals

CLK 80 MHz

Process 0.35 CMOS (3 metal layer) Package T-BGA420 (35x35x1.7 mm) newCSP424 (17x17x1 mm)

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List of trademarks

All product names mentioned herein are trademarks and/or registered trademarks of their respective companies.

The contents of this newsletter may be changed without any notification.

www.epson-electronics.de

info@epson-electronics.de E P S O N E U R O P E E L E C T R O N I C S

Headquarters Munich +49 - (0)89 -140 05 - 0 Office Leverkusen +49 - (0)2171- 5045 0 Office Paris +33 -1- 648 - 623 - 50 Office London +44 - 1344 - 381- 70 0

New ultra-low jitter high frequency clock oscillator

NEW SAW OSCILLATOR EG-2001

QD

The EG-2001 is the first in a new series of ultra-low jitter high frequency clock oscillator solutions by EPSON. The EG-2001 uses EPSON’s high-stability quartz SAW technology which is setting a new performance bench- mark for the latest applications requiring high reference clock frequencies with Ultra Low Jitter. Surface Acoustic Wave (SAW) based oscillators are well known to be the most reli- able and stable oscillators while offering the lowest possible clock jitter available, compared to 3rd overtone and inverted mesa based designs.

Clock Jitter - a common source of problems in high-speed designs - is minimized by the EG-2001 because it oscillates in a fundamental mode only, providing the lowest jitter and noise rejection performance. The direct fundamental mode vibration assures that the jitter of the EG-2001 is among the lowest available for a high-frequency oscillator. System jitter compliance can be more easily achieved in the latest high- bandwidth driven applications including:

■ Gigabit Ethernet

■ Fibre Channel

■ High Speed Processors and System Buses

■ Next Generation Network Technologies

■ High Speed Direct Digital Synthesis

■ Instrumentation

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