76
SAW device
A GND B GND C IN or OUT D OPEN E GND F GND G IN or OUT H OPEN 4.8 ± 0.2 NO.
1.27 1.27 0.8 0.9H
Bottom View
G F
A E
B C D
5.2 ± 0.21.5 ± 0.2
(Unit: mm) (Unit: mm)
External dimensions
Specifications (characteristics)
Recommended soldering pattern
31224 61 E
3.5 2.54 0.95
4.4 1.4
Pat
SAW RESONATOR
FS-555
• Reflow solderable SMD ceramic package.
• Capable of covering a wide frequency range, from 200 MHz to 500 MHz.
• 1.5mm thickness is equal to SMD-type IC.
• Perfect for small wireless equipment.
Item Nominal frequency range Temperature
range
Storage temperature Operating temperature Maximum drive level
Recommended level
Frequency tolerance (standard) Peak temperature
Temperature coefficient Harmonic ratio Series resistance Motional capacitance Shunt capacitance Insulation resistance Aging
Shock resistance
Symbol f0
TSTG
TOPR
GL DL
∆f/f θT
α RS/ R1
R1
C1
C0
IR fa S.R.
Specifications 200 MHz to 500 MHz
-55˚C to +100˚C -40˚C to +85˚C
10mW max.
2mW typ.
±25ppm, ±50ppm, ±100ppm 25˚C ± 15˚C -3.4±0.8 x 10-8/ ˚C2
2 min.
40 Ωmax.
25 Ωmax.
2.6 fF typ.
4.3 pF typ.
500 M Ωmin.
±10ppm/year max.
±10ppm max.
Remarks
Stored as bare product after unpacking
Ta=25˚C ± 3˚C
200 MHz to 249.9 MHz, Ta=25˚C 250 MHz to 500 MHz, Ta=25˚C
( f0= 312.24 MHz ) ( f0= 312.24 MHz )
Ta=25˚C ±3˚C
Nine drops on a concrete from 150 cm or excitation test with 3000G x 0.3ms x 1/2 sine wave x 3 directions
Actual size
